SI5481DU-T1-GE3【PDF 1/9 页】MOSFET P-CH 20V 12A PPAK CHIPFET

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New Product

Si5481DU

Vishay Siliconix

P-Channel 20-V (D-S) MOSFET

PRODUCT SUMMARY

FEATURES

V DS (V)

- 20

R DS(on) ( Ω )

0.022 at V GS = - 4.5 V

0.029 at V GS = - 2.5 V

I D (A)

- 12 a

Q g (Typ.)

20 nC

? Halogen-free

? TrenchFET ? Power MOSFET

? New thermally Enhanced PowerPAK ?

ChipFET ? Package

RoHS

COMPLIANT

0.041 at V GS = - 1.8 V

PowerPAK ChipFET Sin g le

- 12 a

- Small Footprint Area

- Low On-Resistance

- Thin 0.8 mm Profile

APPLICATIONS

? Load Switch, Battery Switch, PA Switch and Charger

Switch for Portable Devices

Marking Code

BC XXX

Lot Tracea b ility

and Date Code

Bottom V ie w

Part #

Code

Orderin g Information: Si54 8 1DU-T1-GE3 (Lead (P b )-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwis e noted

P-Channel MOSFET

Parameter

Drain-Source Voltage

Gate-Source Voltage

T C = 25 °C

Symbol

V DS

V GS

Limit

- 20

±8

- 12 a

Unit

Continuous Drain Current (T J = 150 °C)

Pulsed Drain Current

Continuous Source-Drain Diode Current

T C = 70 °C

T A = 25 °C

T A = 70 °C

T C = 25 °C

T A = 25 °C

T C = 25 °C

I D

I DM

I S

- 12 a

- 9.7 b, c

- 7.8 b, c

- 20

- 14.8

- 2.6 b, c

17.8

Maximum Power Dissipation

T C = 70 °C

T A = 25 °C

P D

11.4

3.1 b, c

T A = 70 °C

2 b, c

Operating Junction and Storage Temperature Range

T J , T stg

- 55 to 150

Soldering Recommendations (Peak Temperature) d, e

THERMAL RESISTANCE RATINGS

260

°C

Parameter

Symbol

Typical

Maximum

Unit

Maximum Junction-to-Ambient

b, f

Maximum Junction-to-Case (Drain)

t ≤ 5s

Steady State

R thJA

R thJC

5.5

°C/W

Notes:

a. Package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See Solder Profile ( http://www.vishay.com/ppg?73257 ). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 90 °C/W.

Document Number: 73777

S-81448-Rev. C, 23-Jun-08

www.vishay.com

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